Modular Probe System

ABSTRACT

A modular probe system that includes components that are selected to test different devices-under-test (DUTs) in a number of different scientific fields. The system includes quick-release connectors that may be used to releasably secure components of the modular probe system to one another or to a mounting interface. These connectors permit quick and easy attachment and detachment of various components in a manner that permits a user to readily configure the probe system for each DUT.

RELATED APPLICATION DATA

This application is a divisional of application Ser. No. 12/023,787,filed Jan. 31, 2008, and titled “Modular Probe System,” whichapplication claims the benefit of priority of U.S. Provisional PatentApplication Ser. No. 60/887,426, filed Jan. 31, 2007, and titled“Modular Probe System and Method,” which are incorporated by referenceherein in their entireties.

FIELD OF THE INVENTION

The present invention generally relates to the field of test devices. Inparticular, the present invention is directed to a modular probe system.

BACKGROUND

Probe systems are used to analyze, examine, and test devices in manyindustries, such as the semiconductor and material science industries.Probe systems are capital equipment that may range in price from $15,000to over $1,000,000. Purchasing capital equipment is believed to be thesecond largest expense associated with operating a semiconductorfacility. Conventional probe systems typically offer no flexibility orupgradeability in terms of size, materials that can be probed and othercapabilities. For example, if a user desires to probe a largersemiconductor wafer than the one for which their existing system isdesigned, that user would likely need to replace the existing systemwith a new probe system or a substantially refurbished system. Inaddition, if a user wants to probe materials in two different scientificfields, e.g., semiconductor and life sciences, two different probesystems are generally required. Particularly for smaller businesses,academic institutions and other organizations with limited capitalequipment budgets, the cost of two probe systems can be prohibitivelyexpensive. Moreover, new probe systems are often not immediatelyavailable, with delivery times of 8-12 weeks being typical. Tocomplicate matters, strong disincentives are believed to exist in theprobing industry to deviate from the use of probe systems that arededicated to a given test, and are not easy to upgrade or otherwisechange.

Modular fixturing systems are known in the prior art. These systemsoften include a base plate having a plurality of apertures for receivingvarious supports for holding a work piece during a manufacturingoperation. The location of the supports is chosen as a function of theconfiguration of the work piece to be supported. Such known fixturingsystems are not believed to include all of the components necessary toperform the manufacturing operation; rather, the fixturing systems aremerely used with such components. In any event, such known fixturingsystems are not used in connection with precision testing of adevice-under-test (“DUT”) through the use of delicate probes, asdiscussed above.

SUMMARY OF THE DISCLOSURE

One implementation of the present invention is a modular test system fortesting a device-under-test (DUT). The system includes a mountinginterface; a plurality of components removably positionable, directly orindirectly, on the mounting interface, the plurality of componentsincluding at least one probe, wherein the plurality of componentstogether are used in connection with testing a DUT; and a plurality ofquick-release connectors for releasably securing the plurality ofcomponents together or to the mounting interface by hand or with onlyhand tools in under 60 minutes.

Another implementation of the present invention is a probe system fortesting a device-under-test (DUT). The probe system includes a basehaving a mounting interface; a first stage releasably secured to themounting interface so as to be replaceable with a second stage in lessthan 60 minutes with only hand tools or by hand; a first chuckreleasably secured to one of the first and second stages so as to bereplaceable with a second chuck in less than 60 minutes with only handtools or by hand, wherein the first and second chucks are capable ofsupporting the DUT; a first manipulator releasably secured proximate oneof the first and second chucks so as to be replaceable with a secondmanipulator in less than 60 minutes with only hand tools or by hand; anda first probe releasably secured to one of the first and secondmanipulators so as to receive test information from the DUT and so as tobe replaceable with a second probe in less than 60 minutes with onlyhand tools or by hand.

Still another implementation of the present invention is a method oftesting a device-under-test (DUT). The method includes a) providing atesting system having a mounting interface; b) releasably securing afirst plurality of components used in testing a DUT to the mountinginterface; and c) removing at least some of the first plurality ofcomponents from the mounting interface and releasably securing a secondplurality of components used in testing a DUT to the mounting interface,wherein the first plurality of components are removed and the secondplurality of components are releasably secured by hand or using onlyhand tools in less than about 60 minutes.

BRIEF DESCRIPTION OF THE DRAWINGS

For the purpose of illustrating the invention, the drawings show aspectsof one or more embodiments of the invention. However, it should beunderstood that the present invention is not limited to the precisearrangements and instrumentalities shown in the drawings, wherein:

FIG. 1 is a schematic top view of a modular probe system;

FIG. 2 is a schematic side view of the modular probe system illustratedin FIG. 1;

FIG. 3 is across-sectional view of a quick-release connector for usewith a modular probe system, such as the modular probe system shown inFIGS. 1 and 2;

FIG. 4 is a flow diagram of an example of a method for using a modularprobe system, such as the modular probe system illustrated in FIGS. 1and 2;

FIGS. 5A-5E are perspective views showing how various components may beadded to and removed from a modular probe system.

DETAILED DESCRIPTION

Referring now to the drawings, FIGS. 1 and 2 illustrate an example of amodular probe system 100 made in accordance with concepts of the presentinvention. System 100 is configured to test a device-under-test (DUT)103, e.g., diced or undiced semiconductor chips in a semiconductorwafer, packaged parts, substrates, printed circuit boards, microscopeslides, and optics and optical components, among others. System 100 isdenoted as being “modular” because it is made up of several components106 releasably secured to a base 108. Some or all of components 106 maybe quickly and easily replaced with other components or freely movedaround to other locations. As a result, modular probe system 100provides a single platform that can be used to perform differentanalysis and/or apply different testing protocols on DUTs fromsubstantially different scientific fields. For example, system 100 canbe first configured to probe a semiconductor wafer and provide dataregarding its performance, and then can be easily reconfigured to probea microscope slide and provide micro-fluidic sampling data used inbiological analysis.

As discussed above in the Background section, a limitation oftraditional probing systems is that their existing structure and/orcomponents cannot be changed, i.e., they are dedicated systems designedto perform just one probing operation on one type of DUT. As alluded toabove, these probing systems typically require extensive physicalmodifications to permit them to perform a different probing operationthat is different than the one for which they were designed, or toperform the same probing operation on a DUT other than the DUT thesystem was originally designed to test. Such changes usually entailmoving the entire probing system to a remanufacturing location remotefrom the facility where it is used. Probing system 100 illustrated inFIGS. 1 and 2, on the other hand, drastically reduces the cost and timeassociated with performing such modifications through the use ofcomponents 106 that may quickly and easily be removed and replaced, inthe field, with other components. That is, components 106 of system 100may be configured to test one aspect of a DUT 103 and then reconfiguredto test another aspect of the DUT. This reconfiguration may be performedby a user, e.g., a lab technician, by hand or through the use ofconventional hand tools (e.g., a screw driver, a wrench) in about 15-30minutes, depending on the type of component 106 being replaced and othercriteria, as discussed more below.

As noted above, probe system 100 includes a base 108 that supportscomponents 106. Suitable materials for use in base 108 will be readilyapparent to those having ordinary skill in the art, and include, withoutlimitation, steel, aluminum, marble, slate, and bronze. While notdepicted specifically in the exemplary probing system of FIG. 1, base108 may include additional structural portions, e.g., a frame. Thesestructural portions are often designed in accordance with specificstandards or, alternatively, are based on the desired application forprobing system 100. For example, some structural portions may beselected in accordance with a particular level of vibration isolation.Other structural portions may be selected for applications that useparticular materials (e.g., chemicals), lighting (e.g., UV lighting), orthat require a particularly high level of electro-static discharge(e.g., rubberized materials).

System 100 may also include a mounting interface 109 that is disposed onbase 108, or, in an alternative implementation, is built into base 108.Mounting interface 109 is generally sized to receive a number ofcomponents 106 at any given time. Preferably, but not necessarily,mounting interface 109 has a surface area of about 1 ft² to about 24ft², although intended application and other factors will dictate theactual surface area chosen. When disposed on base 108, mountinginterface 19 may be made from a variety of materials, such as thosematerials discussed in connection with base 108 above.

Mounting interface 109 is configured so that components 106 may bereleasably secured thereto. To achieve this function, mounting interface109 includes a plurality of apertures 110, e.g., threaded holes, thatare sized and configured to receive quick-release connectors, discussedmore below. Apertures 110 may be evenly distributed over mountinginterface 109. Alternatively, apertures 110 may be located in groups ofvarious numbers and/or patterns. For convenience of illustration, only afew apertures 110 are illustrated in FIG. 1; in most cases, the entiresurface of mounting interface 109, or a significant portion thereof,will include apertures 110. When used with other quick-releaseconnectors, such as the exemplary connectors discussed below, mountinginterface 109 may include other types of apertures, surfaces, and/ormaterials, as desired.

In the example of probing system 100 illustrated in FIGS. 1 and 2,components 106 may include one or more manipulators 113 that receive oneor more conventional probes 112. Probes 112 for use in testing asemiconductor chip, for example, are typically electrically conductivepins and/or projections that are designed to stimulate a particularportion of the semiconductor wafer and receive the response. Probes 112used in other scientific fields may include, but are not limited to,HF/Microwave probes, DC probes, multi-contact wedges, probe cards,micro-fluidic sampling probes, micro-fluidic applicators, refractoryprobes for optics, as desired. These may be selected based on theapplication, e.g., the DUT 103 to be tested and/or the correspondingscientific field. Preferably, but not necessarily, probes 112 arereleasably connected to manipulators 113 in a manner so as to permitthem to quickly and easily added and removed from system 100. Thisfeature improves changeover of system 100 from one type of test toanother on a given DUT 103, or from one DUT to another DUT, as desired.

Although they may be included as an optional component 106 in system100, manipulators 113 are typically of the kind that adjust the locationof probes 112 in relation to DUT 103. Manipulators 113, for instance,may be configured to translate probe 112 in precise increments, e.g,micro-meter (μm) or nano-meter (Nm). They may be manual, e.g.,mechanical or fluid drive, semiautomatic, e.g., motorized withoutencoder feedback or fully automatic, e.g., programmable with encoderfeedback. Manipulators 112 may also include a manipulator arm (notshown). Typical manipulator arms support probe 112 in a manner thatpositions the probe in desired testing relationship with DUT 103.Exemplary manipulator arms include, for example, DC arms, HF/Microwavearms, coaxial/triaxial arms, high current/high voltage arms, inker arms,contact sense arms, adjustable arms, picoprobe arms and others.

Components 106 may also include a support platen 115 that receivesmanipulators 113 and/or probes 112. Generally, support platen 115 isconstructed of conductive or non-conductive materials chosen to supportmanipulators 113, manipulator arms, and probes 112 with the desiredprecision, stability and other requirements needed for the DUT 103 beingtested. For example, support platen 115 may be made of steel oraluminum. In one implementation, platen 115 has a platen surface 118with a surface area from about 1 ft² to about 4 ft². Platen surface 118includes a plurality of mounting positions 121. Each mounting position121 is designed to receive a manipulator 113, manipulator arm, and/orprobe 112. As discussed in more detail below, some or all of mountingpositions 121 can be formed in a manner that enhances the flexibility ofset-up for probe system 100.

Components 106 may further include a platen mount 124 that supportsplaten 118. Like support platen 115 discussed above, each platen mount124 is preferably constructed of conductive or non-conductive materialssuited to support platen 115 (as well as manipulator 113, manipulatorarm, and probes 112). Platen mount 124 includes an upper surface towhich support platen 115 may be attached, directly or indirectly, and abottom surface that rests, directly or indirectly, on mounting interface109 and may be releasably attached thereto, as described more below.Optionally, system 100 may include a translation device (not shown)positioned between support platen 115 and platen mount 124 that permitssupport platen 115 to be moved in one or more directions, such as anx-direction, a y-direction, a z-direction, and/or a θ-direction relativeto stationary platen mount 124. This translation device may providecoarse and fine adjustment of probe 112 relative to DUT 103, and may bemanual, e.g., mechanical or fluid drive, semiautomatic, e.g., motorizedwithout encoder feedback or fully-automatic, e.g., programmable withencoder feedback. Once in its preferred location, support platen 115and/or platen mount 124 may include a locking feature that secures thesupport platen to the platen mount and prevents any relative motionbetween the two.

In one implementation, probe system 100 includes quick-releaseconnectors 133, e.g., connectors 133A-H, that releasably securemanipulators 112, platen mount 124 and other components 106 discussed inmore detail below to one another and/or to mounting interface 109, asthe case may be. In some cases it may be desirable to permanently mountcertain components 106 to mounting interface 109 and releasably secureother components to the mounting interface. In other case, it will bedesirable to releasably secure all components 106 to mounting interface109 using quick-release connectors 133.

Quick-release connectors 133 may be designed to permit a user to operatethe connectors by hand or by using simple hand tools. The design ofconnectors 133 may, if desired, be selected to amplify the force appliedby a user in a manner that permits a component 106 to be securelyattached to and easily removed from probing system 100. Such featuresalso permit components 106 to be moved from one location to anotherwithin probing system 100, as desired.

FIG. 3 illustrates one example of a quick-release connector 133. Here,the exemplary connector 133 is a threaded connector that includes athreaded shaft 136 and a large head 138 attached to the shaft, with thehead being sized configured for comfortable and secure receipt in thehand of a user. When connectors 133 with a threaded shaft 136 will beused in probe system 100, at least some of the apertures 110 in mountinginterface 109 have a diameter and thread pitch corresponding with thatof threaded shaft 136. This arrangement permits connectors 133 to bereleasably threadedly engaged with mounting interface 109. The threadpitch for apertures 110 and threaded shaft 136, and the size andconfiguration of head 138 may be selected so that a typical user ofprobe system 100 can grasp the head, by hand, and secure a component 106to mounting interface 109 by applying a torque of about 1 ft*lbs toabout 50 ft*lbs, as desired. In an alternative configuration, a nut (notshown) may be used in lieu of large head 138 to secure connector 133 inaperture 110. With this alternative configuration, a user may tightenconnector 133 using conventional hand tools such as a ratchet or wrenchby applying a torque of about 1 ft*lbs to about 50 ft*lbs, as desired.In one implementation, connectors 133 may be tightened or loosened withapplication of about 20 ft*lbs of torque.

Quick-release connectors 133 may have other designs, including, but arenot limited to, bolt-down connectors, magnetic interconnections,vacuum-based interconnections, securable pegs, and other implementationscapable of securing components 106 to each other and/or to mountinginterface 109, as the case may be. A more detailed discussion of the useof quick-release connectors 133 will be provided along with a discussionof a preferred method of changing probing system 100 from oneconfiguration to another in connection with FIG. 4, below. Beforeproceeding with that description, however, other components 106 ofprobing system 100 will be described in more detail first.

Components 106 may further include a vision system 151 that can be usedto view and/or examine DUT 103. A variety of suitable devices for use asvision systems 151 are known in the art. Exemplary devices include, butare not limited to, an infrared (IR) microscope, a compound microscope,a stereo-zoom microscope, a camera, a polarizer/analyzer, aclosed-circuit television (CCTV) camera, a CCD-based or other patternrecognition system, and other devices that provide images of DUT 103. Itmay be desirable, for instance, to include in system 100 a microscopethat can be used to visually verify the position of probes 112 as theyrelate to the tested portion of DUT 103, and to view the DUT.

As with the other components of system 100 discussed above, visionsystem 151 may be releaseably secured to mounting interface 109, e.g.,using one or more quick-release connectors 133. This arrangement permitsa user to quickly change from a first vision system 151 to a secondvision system, or permits the vision system to be moved from a firstposition to a second position. To facilitate mounting and operation ofthe vision system 151, the latter may include, for example, stand alonebooms, posts or bridges, a bread board boom, vision movement stages withor without vision lift, and other devices.

Components 106 include a chuck 154 and a stage 157 that supports and,optionally, can be used to position the chuck. Chuck 154 is shaped andconfigured based on the size and configuration of DUT 103. For example,when DUT 103 is a semiconductor wafer as illustrated in FIGS. 1 and 2,chuck 154 includes a support surface 160 that supports the semiconductorwafer. Support surface 160 is generally a flat surface formed of asuitable structural material, e.g., aluminum, steel, plastic. In someexamples, support surface 160 and chuck 154 may be configured to securethe semiconductor wafer with a vacuum or mechanical clamping. Otherimplementations of system 100 may require other configurations of chuck154. For example, when used in the life science field, chuck 154 may beshaped and configured to receive a liquid. In other examples, chuck 154may be configured to receive a printed circuit board, substrate orpackaged part, a high temperature crucible, a specimen slide, asdesired.

It may be desirable to provide a stage 157 that allows chuck 154 to beadjusted in order to place DUT 103 in a selected position for analysisand examination. Such adjustments may accommodate differences in theheight and/or thickness of the variety of chucks 154 discussed above.For example, stage 157 may be manipulated in a variety of directions,e.g., an x-direction, a y-direction, a z-direction, and/or aθ-direction. Like other components 106 of modular probe system 100,stage 157 is configured to be releasably secured to mounting interface109 via connectors, e.g., quick-release connectors 133. Using theseconnectors, modular probe system 100 can be configured to include astage 157 that operates manually, e.g., using a mechanical or fluiddrive, semiautomatically, e.g., using a motorized device without encoderfeedback or fully-automatically, e.g., one that is programmable withencoder feedback

Components 106 may optionally include a DUT handler 163 (FIG. 2) thatsemiautomatically or automatically moves DUTs 103 onto, and removes theDUTs from, chuck 154. Of course, DUTs 103 may be manually positioned onchuck 154. Typically, but not necessarily, DUT handler 163 interactswith stage 157, probes 112 and/or vision system 151 in connection withits transport of DUT 103. Again, like other components 106 in probesystem 100, DUT handler 163 may be releasably secured to mountinginterface 109 using quick-release connectors, e.g., connectors 133.

Components 106 may further include a controller 166 (FIG. 1) connectedto probes 112 to receive test information detected by the probes.Controller 166, like other components 106, may be releasably secured tomounting interface 109 using quick-release connectors 133. Controller166 can be any sensing device that is able to measure an entity andreturns a result that the operator can use to determine if the DUT isgood, bad or marginal. Controller 166 can be used to measure, but is notlimited to measuring, current, voltage, resistance, capacitance,HF/Microwave, pressure, optical, fluidic measurement systems.

FIG. 4 illustrates the steps of a method 300 for configuring a modularprobe system, such as modular probe system 100 of FIG. 1. Method 300, atstep 305, involves positioning a probe system in a testing environment.As discussed above, a feature of a modular probe system 100 made inaccordance with concepts of the present invention is that it does notneed to be moved from its testing environment for upgrades,modifications, and other changes. Rather, it requires a substantiallyone-time set-up. Such set-up may include placing the probe system in thetest environment, leveling the platform in accordance withpre-determined standards, securing the platform to the floor or otherportion of the test environment, and other steps used in setting upsimilar test and probe equipment.

Method 300 includes, at step 307, determining the requisite components106, e.g., probes 112, vision systems 151, chucks 154, necessary toperform the desired test for DUT 103. As discussed above, modular probesystem 100 may be configured to perform a wide variety of tests, on awide variety of DUTs 103, in an wide array of scientific fields.

Method 300 further includes, at step 309, positioning each of theselected components 106 in probe system 100 in a manner that permits auser to test one or more properties of a DUT 103. Preferably, eachdevice can be positioned using one or more quick-release connectors,such as quick-release connectors 133 discussed above. Typically, thiswill take a user no longer than 15-30 minutes with or without handtools.

Next, method 300 includes, at step 311, performing the desired test onDUT 103.

Method 300 includes, at step 313, determining whether components 103need to be changed to test a different property of the DUT, to test adifferent DUT, and/or to test a different DUT in a different scientificfield. As discussed above, modular probe system 100 discussed herein isdesigned to provide a flexible test platform. That is, modular probesystem can be set up (using requisite components, probes, and visionsystem) for a first test property on a first DUT in a first scientificfield. It can then be reconfigured to test a second test property on asecond DUT in a second scientific field in just a few minutes. Forexample, if the first DUT is a semiconductor wafer, then components 106are configured in a manner that permits testing of a first electricaltest property on the wafer. Then, when a second electrical test on thewafer is to be, performed, components 106 can be moved, adjusted, orotherwise reconfigured to test the second test property. Next, when abiological test is to be performed on a sample on a microscope slide,then components 106 can be removed, changed, added, or otherwise placedin a configuration suited to perform the biological test.

If it is determined at step 313 that components 106 need to be changed,then the method returns to step 309. If, on the other hand, it isdetermined at step 313 that no change in components 106 is needed, thenthe method ends at step 315.

FIGS. 5A-E illustrate examples of how a modular probe system, i.e.,probe system 400, may be differently configured using a method, such asmethod 300 discussed above. In a first configuration, as shown in FIG.5A, system 400 includes a base 408 having a mounting interface 409 witha plurality of apertures 410.

Next, as shown in FIG. 5B, components 406 are added. These components406 include a two-part stage 457 having a Z-stage 457A and a theta stage457B, which are releasably connected to mounting interface 409 using oneor more quick-release connectors 433, only one of which is shown forconvenience of illustration. In the present example, stage 457 includestwo adjustable moving plates 458. Preferably, plates 458 may beconfigured to receive a chuck (not shown) or DUT (not shown). They oftencan be actuated in a manner that permits it to receive chucks and/orDUTs of various sizes, shapes, and overall configurations.

Turning next to FIG. 5C, probe system 400 is shown with a collection ofcomponents 406 that differs from the collection illustrated in FIG. 5B.This second configuration includes, for example, components 406 selectedto test a different DUT 103 than the DUT being tested in the probesystem 400 shown in FIG. 5B, in a different scientific field.Accordingly, stage 457, which could be used to support a semiconductorwafer, for example, is removed and is replaced with a second stage 457,which, for example, may be used to support a life science DUT 103 (notshown). Other components 406 may also be added, such as adjustableheight instrumentation and optics mounting plates 470, manipulator 472,and tool-support posts 474. Components 406 illustrated in FIG. 5C may bereleasably secured to mounting interface using quick-release connectors433. Typically, the change-over from the set-up shown in FIG. 5B to theset-up shown in FIG. 5C does not exceed about 30 minutes, and can beperformed by a user without tools, or, alternatively, with hand tools.More generally, the change-over may take from about 10 minutes to about45 minutes.

Referring to FIG. 5D, yet another configuration of probe system 400 isillustrated. Here, several tool-support posts 474 are releasably securedto mounting interface 409 via tool-less mounting plates 476. A supportplaten 415 is then mounted on posts 474, all by hand or with simple handtools. A plurality of quick-release connectors 433, only one of which isshown for convenience of illustration, are used to secure the variouscomponents 406 to mounting interface 409.

Turning next to FIG. 5E, the change in configuration of components 406illustrated in FIG. 5D continues in FIG. 5E. Probes 412 and manipulators413 are secured to support platen 415 using quick-release connectors433, vision system 451 is added, and a tool-less mounting bridge 480 isprovided. Typically, about 15-30 minutes is required to add thecomponents 406 illustrated in FIG. 5E to the components 406 illustratedin FIG. 5D.

Exemplary embodiments have been disclosed above and illustrated in theaccompanying drawings. It will be understood by those skilled in the artthat various changes, omissions and additions may be made to that whichis specifically disclosed herein without departing from the spirit andscope of the present invention.

1. A modular test system for testing a device-under-test (DUT), saidsystem comprising: a mounting interface; a plurality of componentsremovably positionable, directly or indirectly, on said mountinginterface, said plurality of components including at least one probe,wherein said plurality of components together are used in connectionwith testing a DUT; and a plurality of quick-release connectors forreleasably securing said plurality of components together or to saidmounting interface by hand or with only hand tools in under 60 minutes.2. A modular test system according to claim 1, wherein said plurality ofcomponents include a chuck for supporting a DUT during testing, a stagefor moving said chuck and the DUT, a manipulator for supporting said atleast one probe in selected relationship to the DUT, and a vision systemfor generating images of portions of the DUT.
 3. A modular test systemaccording to claim 1, wherein said plurality of components include achuck for supporting a DUT during testing, a material handler for movingthe DUT onto and off of said chuck, and a manipulator for supportingsaid at least one probe in selected relationship to the DUT, furtherwherein at least one of said chuck, material handler and manipulatorinclude a translation device for moving said at least one said chuck,material handler and manipulator, said translation device having manual,semiautomatic or fully automatic operation.
 4. A modular test systemaccording to claim 1, wherein said plurality of components includes avision system releasably secured to said mounting interface, said visionsystem providing an image of the DUT.
 5. A modular test system accordingto claim 1, wherein said translation device moves said DUT in a manualor automatic mode.
 6. A modular test system according to claim 1,wherein said plurality of quick-release connectors has a release torquethat does not exceed about 50 ft*lbs.
 7. A modular test system accordingto claim 1, wherein said plurality of quick-release connectors has arelease torque that does not exceed about 20 ft*lbs.
 8. A modular testsystem according to claim 1, wherein said mounting interface includes aplurality of apertures shaped and configured to engage with saidplurality of quick-release connectors.
 9. A modular test systemaccording to claim 1, wherein said plurality of components includes afirst chuck for supporting a first DUT used in a first technical fieldand a second chuck for supporting a second DUT used in a secondtechnical field that is different than said first technical field.
 10. Amethod of testing a device-under-test (DUT), said method comprising: a)providing a testing system having a mounting interface; b) releasablysecuring a first plurality of components used in testing a DUT to saidmounting interface; and c) removing at least some of said firstplurality of components from said mounting interface and releasablysecuring a second plurality of components used in testing a DUT to saidmounting interface, wherein said first plurality of components areremoved and said second plurality of components are releasably securedby hand or using only hand tools in less than about 60 minutes.
 11. Amethod according to claim 10, wherein said removing step involvesremoving said first plurality of components and releasably securing saidsecond plurality by hand or using only hand tools in less than about 30minutes.
 12. A method according to claim 10, further comprising:performing a first test on a first DUT following said releasablysecuring step b) and before said removing step c); and performing asecond test on a second DUT following said removing step c), whereinsaid second DUT is used in a different technical field than said firstDUT.
 13. A method according to claim 10, further comprising: performinga first test on a first DUT following said releasably securing step b)and before said removing step c); and performing a second test on asecond DUT following said removing step c), wherein said second DUT hasa different size than said first DUT.
 14. A method according to claim10, wherein said removing step c) involves removing at least some ofsaid first plurality of components with a torque that does not exceedabout 50 ft*lbs and releasably securing said second plurality ofcomponents with a torque that does not exceed about 50 ft*lbs.
 15. Amethod according to claim 10, wherein said removing step c) involvesremoving at least some of said first plurality of components with atorque that does not exceed about 20 ft*lbs and releasably securing saidsecond plurality of components with a torque that does not exceed about20 ft*lbs.